Shanghai Gawin Electronic Technology Co., Ltd.  

Product Name: 8layer Enig+OSP HDI PCB Electronics Manufacturing Services Model NO.: GW-1920421748 Insulation Materials: Epoxy Resin base Material: Copper Production Process: Blind&Buried Vias Processing Technology: Enig+OSP Flame Retardant Properties: V0 Application: Consumer Electronics Material: Epoxy Paper Laminate Dielectric: FR-4 Structure: HDI PCB Layer Count: 4layer - 64layer HDI Structure: 1+N+1 to Any Layer Min. Trace/Space: 2/2mil Transport Package: Vacuum + Carton Packing Origin: Made in China HS Code: 8534001000 Product Description HDI Layer Count4L-32L mass production, 34L-64L quick-turnMaterialHigh Tg material (Recommend Shengyi Material)Finished Board Thickness0.8-4.8mmFinished Copper ThicknessHoz-8ozMax. Board Size600x800mmMin. Drilling Size0.15mm, 0.1mm(laser drilling)Blind/Buried vias depth ratio1:1Min. Line Width/Spaceinner 2/2mil, outer 3/3milSurface FinishENIG, Immersiong Silver, Immersion Sn, Plated Gold, Plated Sn, OSP ect.StandardIPC Class 2, IPC Class 3, MillitaryApplicationIndustrial, Automotive, Consumer,Telecom, Medical, Military, Security ect.Other3+N+3 to any layerHDI circuit board advantages:1. Reduce PCB cost: when the density of PCB increases more than eight layers, it will be manufactured with HDI, and the cost will be lower than that of the traditional pressing process;2. Increase circuit density: interconnection between traditional circuit board and parts;3. Conducive to the use of advanced construction technology;4. Better electrical performance and signal correctness;5. Better reliability;6. Improve the thermal properties;7. Improve RF interference, electromagnetic interference and electrostatic discharge (RFI/EMI/ESD);8. Increase design efficiency.Maybe we don't have the lowest price, but can guarantee you the best quality.If you are interested, welcome to contact us. Here is the contact information as follows:Shanghai Gawin Electronic Technology Co., Ltd.Web: www.gawin-tech.comMain Inspection Equipement